Valtronic is an international leader in the field of custom designed miniaturized electronic circuits, many of which are used in medical devices. Valtronic is an ISO certified facility with over 75% of their manufacturing dedicated to miniaturized medical devices, including those for in-vivo and in-vitro applications. In addition, Valtronic is also involved in a number of research and grant projects exploring the increased opportunities of sensors and their applications, advanced miniaturization techniques and other electronics processes.

    Valtronic is on of the world's leading experts in extreme miniaturization for electronic packaging and manufacturing. Valtronic's expertise lies in combining microelectronics with micromechanics. It is our mission to improve the quality of life for others through out technology. We offer a full turnkey solution including, but not limited to: project management, procurement, assembly, testing and specialized shipping. Assembly technologies utilized by Valtronic include Chip-on-Board, Flip-Chip, Chip-On-Chip, Multi-Chip-Module, 3D packaging, SMD, etc.

1982 – Present - Vice President of Technology at Valtronic USA, Inc. Solon, Ohio

Mr. Styblo has 40 years of experience in the electronics’ industry, electronic design and manufacturing utilizing technologies that include Chip-on-Board (both aluminum and gold wire bonding), Flip-Chip and SMT. In 1986 he established Valtronic USA, Inc. in Cleveland, Ohio. Bringing the advanced microelectronics packaging expertise from Valtronic SA in Switzerland, Valtronic USA, Inc. expanded from a small office with a lab and built a unique 28,000 square foot engineering and manufacturing facility complete with a clean room in Solon, Ohio. Today, Valtronic USA, Inc. successfully manufactures over 50 different miniaturized electronic subassemblies from prototyping to high volume quantities. Valtronic USA, Inc. has manufactured well over $150M in the first 20 years of existence; 75% of these subassemblies are utilized in the medical industry as both in-vivo and in-vitro products.

1974-1980 / 1982-1986 - Ohio Nuclear / Technicare Corp. (a J&J company):

1974-1980 - Electrical Engineer, then Project Engineer. As part of the original design team on the world's first full body CT Scanner in 1974, Don holds patents on this Scanner. 1982-1986 - Supervisor of hardware engineering for the High Performance HPS1440 Scanner at Technicare Corp. During a ten-year period, that included the design and development of 10 CT Scanner models. The Ohio Nuclear/Technicare/J&J engineering team designed manufactured and shipped greater than $2B worth of product and by 1986 Technicare's CT equipment was scanning over 8,000 patents per day worldwide.

1980-1981 - Gould Ocean Systems Division: Lead Design Engineer:

Navy's MARK 48 ADCAP Torpedo: Mr. Styblo was the Lead Design Engineer on the aft body electronics, of which included the Alternator / Regulator (>25 KW) power conversion (>260watts/lb.generator), aft body Low Voltage Power Supply and Launch Sequencer for the Navy's MARK 48 ADCAP Torpedo (ADvanced CAPability torpedo). Within 18 months he lead his team of seven engineers and won a $110 million dollar swim-off contract and successfully developed a counter measure force for the USSR's Project 705, 705 K (Lira) - Alfa Class sub threat. Note: The MARK 48 ADCAP Torpedo is still the Navy's number one ASW heavy weight weapon.

Ohio Third Frontier Grant 2006-2007:

Mr. Styblo is the lead technology person on the Ohio Third Frontier funded Photobiotherapy project at Valtronic USA, Inc., in regards to packaging the optoelectronics, semiconductor die, processor and power supply. On this project, Valtronic will utilize its proven bare die gold-on-gold, flip-chip miniaturized manufacturing process to satisfy the Photobiotherapy Probe design. This Photobiotherapy Probe will establish a new standard in Patient Therapeutic Technology for the medical industry.

Additional Research Optics and Photonics during the last 3 years:

1. Advanced-ThermoPhotoVoltaics (A-TPV™) Project: Utilizing InAs Solid-State III-V Epiwafers, Quantum Dot Technology for a Solid-State High-Efficiency Co-Generation Solid-Oxide-Fuel-Cell (SOFC) Increase SOFC efficiencies up to 80% (patent pending)

2. High Powered Advanced-LED Light-Emitting-Diode Projects: Manufacturing optoelectronics, semiconductors, and MEMS devices, with a focus on III-V materials of combinations of InAs, GaAs, GaAlAs, GaAllnP, InP, InGaAs InGaAlP and InGaAlAs materials. Utilizing the InAs material the team has developed the A-TPV™ Quantum Dot Process, a High Powered (4.4Watts/ sq. cm output power,) advanced LEDs at an infrared frequency of 2,400 nm.

SYNERGISTIC ACTIVITIES, COLLABORATORS and OTHER AFFILIATIONS:

1. iSMART” Patch Technology for Continuous Metabolic Monitoring, PI: Dr. Brent D. Cameron, Professor, University of Toledo Department of Bioengineering iSMART” patch system, which stands for integrated Sensors for Multiple Analysis with wiReless Technology, a project proposed to the US ARMY’s Metabolic Monitoring Panel.

2. Multi-Dimensional Imaging, Inc. Dr. Harvey Eisenberg, M.D., Development of a new standard in non-invasive Medical Imagining funded by DARPA & the US ARMY.

3. Member of the University of Toledo’s Department of Bioengineering Industrial Advisory Board.

4. Member of IPC’s Performance Specifications Task Group for IPC-6015, Qualifications for Organic Multi-Chip Module (MCM-L) Mounting and Interconnecting Structures

5. Member of International Microelectronics and Packaging Society (iMAPS)

6. Member NeoMop, Optical Electronics manufacturing in Ohio